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PCB Assembly and Test Capabilities Data SheetPlated-Through-Hole (PTH)
- DIP, SIP, VCD, ZIP, and Radials
- Board sizes up to 18" x 20"
- Sequencing capabilities
Surface Mount Technology (SMT)
- Single and double sided products
- To 15 mil pitch
- No clean process or standard deionized water wash process
- Board sizes up to 18" x 20"
- 0402 series passive component placement capability
- Fuji CP III and CP VI's
- IP II, IP III and QP-242E's
- DEK 265 GSX Automated Stencil Printers
- K & S 1470 Hybrid Wedge Bonders
- K & S 4123 Al/Gold Wedge Bonders
- Olympus 500X and 10X Microscopes
- Royce 550 Auto Pull Testers
- Air/N2 Convection Reflow Ovens
- Closed Loop Wave Soldering Equipment
- Glenbrook and Nicolet X-Ray Equipment
- SMD Soldering Machines
- SRT Rework Stations
- Utra-sonic Welding of PCMCIA Modules
Chip-on-Board (COB)
- Gold wire bonding
- Aluminum wire bonding
Ball Grid Array (BGA)
- Ceramic (CBGA)
- Plastic (PBGA)
- Tape (TBGA)
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